Next week, the 15th Labelexpo Americas returns to the Donald E. Stephens Convention Center in Rosemont, IL, USA, just outside Chicago. According to show organizers, the biennial event will be the largest to date, and in addition to the more than 400 exhibitors on hand presenting their latest innovations, Labelexpo is also offering extensive opportunities for attendees to get educated on the latest trends from both converter and consumer perspectives.

Introducing the Linerless Trail
The Linerless Trail is set to make its North American debut. Introduced by Labelexpo in Brussels last year, it aims to give printers and converters an insight into a form of product identification and decoration that results in reduced costs, less waste and improved sustainability across the supply chain. Companies participating in the Linerless Trail include Appvion, Bostik, Evonik, Henkel Corporation, Innovia Films, Maan Engineering, Max International Converters, MPS, NAStar and Ravenwood Packaging.

Linerless labels are pre-printed pressure sensitive labels that do not contain the traditional release coating and liner format that stops it from sticking to other labels. Showcasing this technology, the Linerless Trail participants will be highlighting the commercial benefits of adopting and offering a linerless capability to customers. Visitors to the show will be able to see live demonstrations as well as collect linerless samples.

Linerless labeling advantages include more labels on a roll, fewer roll changes, and transportation benefits including reduction in shipping costs due to lighter weight rolls of labels.

A Finishing Touch
Another highly anticipated feature area of the show is The Digital Finishing Experience, which will showcase Xeikon and Delta ModTech machinery capabilities. 

A Delta ModTech Spectrum Finishing system will be one of the centerpieces of the Digital Finishing Experience. Tight tolerance semi-rotary die-cutting, high-speed output and on-the-fly changeovers are just some of the capabilities to be featured by the machine. With the company’s INTELLI-MOD control system and easy to use touchscreen HMI, attendees will see how operators are able to quickly changeover from job-to-job, helping converters compete in an industry that’s rapidly shifting from mass production of static print to smaller custom runs on digital technology. The control system also includes proven print-to-die registration software that will automatically adjust the diecuts to print variations.


As part of The Digital Finishing Experience, Xeikon will be premiering the Xeikon FDU, which is designed to fit in any digital production process for carton, tags and sheetfed labels. Developed to aid efficient end-to-end printing and converting for folding carton printers, it is ideal for near-line finishing of digital work but can also accommodate offset litho runs. This 2000-sheet-per-hour flatbed system handles sheet sizes from 400 x 400mm (15,7”x 15,7”) up to 530 x 1000mm (20,9”x 39,4”) and a maximum die-cut size of 490 x 700mm (19.2 x 27.6”). Substrate thickness can range from 160 to 890 micron for paper and carton board and also micro flute corrugated board can be finished, making it ideal for completing offset as well as digital runs.

With live technical demonstrations taking place over Labelexpo’s three-day run, visitors will be able to see how they can build complexity into folding cartons, speed up their delivery times, become more profitable and set their services apart. Presentations will be held daily at 11 AM and 3 PM and at only 11 AM on the show’s closing day.

Sixteen Sessions
For some, the conference program portion of the show is an integral part of the Labelexpo experience. Sponsored by HP Indigo, the program’s 16-session speaker and panel lineup will cover the latest advances in key and emerging technologies. Attendees will also hear first-hand about industry trends, changes and developments from sector specialists.

The conference opens with the CEO panel discussion and an overview of the latest label market trends. Moderated by Georges Gravanis of Avery Dennison, panelists will include John Attayek of Inovar Packaging Group, McDowell Label’s John McDowell, John Cappy of the Outlook Group and Fortis Solutions Group CEO John Wynne. These label converting company leaders will discuss issues including consolidation in the marketplace, investing for the future and how to equip the industry’s workforce of tomorrow.

The afternoon session on Day One will be split into two streams with the first focusing on digital technologies. Individual presentations will include a look at inkjet systems for industrial applications with contributions from TLF Graphics and McLoone Metal Graphics, as well as digital print finishing for labels and packaging and customizing seasonal products using digital printing.

Stream Two will highlight smart and interactive products and include several real life case studies. Thin Film Electronics and Canadian printer Jones Packaging will be sharing their expertise in integrating NFC labels with packaging for global pharmaceutical products. The second case study will highlight the use of smart labels and packaging in increasing consumer engagement with Constantia Labels and Inland giving an insight into working with the Oculto and Cubanisto beer brands.

The second day of the conference will include the converter panel discussion and an update on how the Internet of Things (IoT) is impacting on the label market. The afternoon is again split into two streams and concentrates on new technical innovations and package printing.

New innovations being covered will include the latest advances in linerless labels, as well as implementing an effective MIS system to improve workflow and profitability. Package printing presentations will feature a panel discussion on flexible and folding carton printing and with the market moving away from paper, the last session explores diversifying into new markets by adopting film labels and flexible packaging.